Guest Editors
Linjie Zhou
Shanghai Jiao Tong University
China
Xianshu Luo
National Semiconductor Translation and Innovation Centre (NSTIC)
Singapore
Submission Deadline: 31 October 2025
Publication Date: Spring/Summer 2026
Call for Papers
Advanced Photonics Nexus invites submissions to the theme issue titled “Co-Packaged Optics”.
Co-packaged optics (CPO) is an emerging, transformative technology that integrates optical interconnects directly with electronic components, addressing the increasing demands for higher bandwidth, lower latency, and improved energy efficiency. Recent advancements in integrated photonics, high-speed optical transceivers, and advanced packaging techniques are reshaping the landscape of high-performance computing and telecommunications.
This special theme issue aims to provide a comprehensive overview of state-of-the-art research in CPO, encompassing innovative device architectures, advanced materials, thermal management solutions, and robust integration strategies. We invite both experimental and theoretical contributions that showcase novel approaches and breakthroughs in this rapidly evolving field.
Topics of interest include, but are not limited to:
•Integrated optical-electronic platforms
•Advanced packaging techniques for optical transceivers
•Thermal management strategies for high-density opto-electronic modules
•High-speed photonic and electronic integration
•Innovations in optical interconnects and fiber coupling techniques
•Emerging materials and fabrication methods for CPO
•Reliability and scalability of optical-electronic designs
•Co-design strategies for electronic and photonic convergence in communication systems
•Applications in data centers, next-generation networks, and high-performance computing
All papers will undergo a rigorous peer review process. Manuscripts for Advanced Photonics Nexus should be prepared in accordance with the journal guidelines. Authors must include a cover letter indicating that the submission is intended for this spedial theme issue.
