• Chip
  • Vol. 3, Issue 3, 100105 (2024)
Bo Li1, Jinpei Lin1, Linfei Gao1, Zhengweng Ma1, Huakai Yang1, Zhihao Wu1, Hsien-Chin Chiu2, Hao-Chung Kuo3, Chunfu Zhang4, Zhihong Liu4, Shuangwu Huang1, Wei He1, and Xinke Liu1、*
Author Affiliations
  • 1College of Materials Science and Engineering, College of Electronics and Information Engineering, Institute of Microelectronics (IME), Guangdong Research Center for Interfacial Engineering of Functional Materials, State Key Laboratory of Radio Frequency Heterogeneous Integration, Shenzhen University, Shenzhen 518060, China
  • 2Department of Electronic Engineering, Chang Gung University, Taoyuan 333, China
  • 3Department of Photonics and the Institute of Electro-Optical Engineering, and with Foxconn Semiconductor Research Institute, National Chiao Tung University, Hsinchu 300, China
  • 4Xidian University, School of Microelectronics, Xi'an 710071, China
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    DOI: 10.1016/j.chip.2024.100105 Cite this Article
    Bo Li, Jinpei Lin, Linfei Gao, Zhengweng Ma, Huakai Yang, Zhihao Wu, Hsien-Chin Chiu, Hao-Chung Kuo, Chunfu Zhang, Zhihong Liu, Shuangwu Huang, Wei He, Xinke Liu. Electrical performance and reliability analysis of vertical gallium nitride Schottky barrier diodes with dual-ion implanted edge termination[J]. Chip, 2024, 3(3): 100105 Copy Citation Text show less
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    Bo Li, Jinpei Lin, Linfei Gao, Zhengweng Ma, Huakai Yang, Zhihao Wu, Hsien-Chin Chiu, Hao-Chung Kuo, Chunfu Zhang, Zhihong Liu, Shuangwu Huang, Wei He, Xinke Liu. Electrical performance and reliability analysis of vertical gallium nitride Schottky barrier diodes with dual-ion implanted edge termination[J]. Chip, 2024, 3(3): 100105
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