An orthogonal experimental method was used to optimize the parameters of automatic eutectic die attach for controlling the void rate and shear strength. The three key parameters of attach temperature, attach time and attach pressure were analyzed by three factors and two levels of orthogonal method. The primary and secondary factors which were affecting eutectic attach quality was obtained, and the best optimal combination of attach parameters was also obtained. The experimental results showed that the die eutectic attach quality was improved obviously by using the optimized parameters combination. The average void rate of die eutectic soldering zone and the Cpk value of chip shear force were fully meeting the requirements of GJB548B.