Ultra-weak infrared light detection based on steep-slope phototransistors
  • SJ_Zhang
  • May. 18, 2025

Abstract

A photodetector’s sensitivity is conventionally quantified by specific detectivity, which balances responsivity and noise. However, we reveal that the turn-on threshold power is fundamentally governed by photo-carrier injection rather than detectivity. In conventional phototransistors/diodes, incident light cannot generate photocurrent via thermionic injection until its intensity saturates the surface potential. To overcome this limit, we design a photo-tunneling transistor with a partially dual-gated black phosphorus channel. This device breaks the injection barrier, achieving a temperature-independent subthreshold swing of ~50 mV/dec up to 250 K and reducing the threshold power by over an order of magnitude. At 80 K, it detects mid-wave infrared light with a minimum power of ~35 pW, outperforming conventional phototransistors with higher detectivity by ~30-fold. Our work redefines the sensitivity criteria for photodetectors and highlights the potential of steep-slope transistors in low-power optoelectronics, offering a pathway to ultrasensitive infrared sensing and imaging technologies.

Introduction

The ability to detect a weak light shapes the sensitivity of a photodetector. In traditional photo-detectors, light is regarded as detectable when the photo-current happened to be extracted from noise. The photo-response and noise floor thus naturally qualify the lowest detectable light1,2,3. As schematically illustrated in Fig. 1a, a detector with higher responsivity (R) or lower noise equivalent power (NEP) is better ability to detect weak light. To date, enhancing light absorption, increasing quantum efficiency and compressing dark-current fluctuation forms the major performance boosters for photo-detecting applications4,5,6. Unfortunately, this strategy is challenging for some important applications, such as noisy mid-infrared (MIR) photodetectors. In this article, we point out that the turn-on threshold of conventional photo-diode/transistor is limited by the photo-injection of carriers, but not determined by the detectivity. A phototransistor can unexpectedly have a better threshold power (Pth) even with lower detectivity, as shown in Fig. 1a.

 

Fig. 1: Concept and origin for turn-on threshold power of photo-transistors.

figure 1

a Schematic of threshold power of a photo-detector. The minimum detectable powers of two photo-transistors are determined by their detectivity (P1 & P2). Another detector with optimized limit of detection present better threshold power (P3), even though its responsivity (R) is lower. b Origin of threshold power in a photo-transistor (defined by Source (S), Drain (D) and Gate electrodes). c channel charges below (regime 1) and above (regime 2) threshold. d The structure of a photo-transistor under light (??) illumination, Ec represent the conduction band energy. Band-bending defines the surface potential (ψS), ?????? represents quantum capacitance, q is the elementary charge; e surface potential and charge density as functions of incident light power for the photo-transistor channel, the arrow indcates the photocurrent flow.

Results

To examine our argument, we begin by analyzing the working mechanism for a semiconductor phototransistor/diode. This kind of device is the most commonly used photodetector, It mainly contains a semiconductor (e.g., p-n or p-i-n) junction7 (It should be noted that a photodiode is similar to the photo-transistor in terms of the junction turn-on process. Below we refer to the terminology of “phototransistor” to both phototransistor and photodiode. Lightly doped or intrinsic active regions are usually selected to provide higher light absorption and lower dark noise. Generally, the phototransistor is thought to work in linear region. Under these circumstances, the photo-generated free carriers are separated and transported by the built-in or applied bias field, leading to a photo-current flow in the external circuit. In contrast, for weak light, the device should be operated in sub-threshold region (See Supplementary Information Note 1 for details). It is worth mentioning that in this process, photo-current generation requires the injection of carriers over an energy barrier at the (e.g., contact or PN) junction, distinctively different from the mechanism in the linear region. Specifically, photo-carriers firstly shift the Fermi-level of the semiconductor channel (by filling its quantum capacitance) to lower this energy barrier. With higher photo-carrier density, free-carriers are subsequently induced to support a linear region photo-current. In short, under weak illumination, traditional thermionic injection is insufficient to contribute enough free-carriers unless the surface potential is fully saturated, as sketched in Fig. 1b. Instead of getting a linear region photo-response as soon as illuminated, the incident light firstly drives a sub-threshold current to gradually turn-on the junction. It needs to reach certain power level to render the sub-threshold current compete with the noise and detectable as illustrated in Fig. 1c–e. Apparently, this power level defines the turn-on threshold of a photodetector.

The aforementioned photodetector turn-on process is well analog to the sub-threshold region of a field-effect transistor (FET). Therefore, steep-slope transistor techniques such as tunneling FET8,9,10,11, impact ionization MOS12,13,14,15, negative capacitance FET16,17,18 and feedback FET are suitable for improving the lowest detectable light power of a phototransistor. As an example, we fabricated a BP based tunneling FET to verify our hypothesis.

BP photo-tunneling transistor

Figure 2a, b show the cross-section and a typical scanning electron microscopy (SEM) image of the proposed device. A BP channel with 5-nm thickness support MIR photo-detecting19,20,21,22,23,24 is sandwiched between two hexagonal Boron Nitride (hBN) protection flakes. We chose the sample with a thickness ~5 nm to balance the detecting range and leak current. Specifically, thin samples are not suitable for MIR application. Because the bandgap is too small (e.g., >1.3 eV for monolayer samples). And thick samples are also not suitable because the resulting tunneling barrier is too small to close the device. Few-layer graphene electrodes are used to improve the contact. The device consists of two sets of gates. A graphite bottom gate modulates the whole channel. On one hand, it is used to test the sub-threshold swing (SS) of the transistor; on the other hand, it also globally dopes the channel to provide a suitable dark bias for photo-detection measurement. Additionally, two top gates only covering the (source and drain) contact regions are fabricated to form a tunneling diode structure in the FET. By partially doping the channel with a high top gate voltage, we managed to induce a sharp barrier along the channel to form a lateral tunneling junction as schematically sketched in Fig. 2c, while the schematic band-diagram profiles for a conventional FET photo-transistor are also given in Fig. 2d for comparison.

 

Fig. 2: Black phosphorus (BP) photo-tunneling transistor.

figure 2

a Schematic of device structure, showing BP channel, graphene contacts (with source and drain electrodes Vs and Vd), bottom gate (Vbg), and two partial top gates (Vtg1 and Vtg2) as well as the dielectric layer of hexagonal Boron Nitride (hBN). b Scanning electron microscopy (SEM) photograph (with false color) of a representative device in (a), the colored dashed line indicate different layers of the device: yellow for bottom hBN and white for top hBN, while the solide white line indicates the bottom gate, the scale bar is 10 ?m. cd illustrate the schematic band-diagram profiles for the principal operation of different photo-transistors. Specifically, they depict the dark (dashed blue line) and light-illuminated (red line) cases in a photo-tunneling transistor and a conventional field-effect transistor (FET), respectively. With a band-to-band tunneling (thermionic) charge injection mechanism, the device has a steep (smooth) Sub-threshold Swing (SS) and response (does not respond) to weak light, Id represents the source-drain current, Ef denotes the fermi level and Ev indicates the valence band energy of the BP channel. e Room-temperature transfer curves of the device in (b) at different modes. Without top gate (Vtg), the device is an ambipolar FET (black curve). With Vtg1 = 6 V (Vtg2 = −6 V), the device is configured as p-type (n-type) tunneling-transistor Vds = 0.1 V. fg are enlarged transfer curves for tunneling transistor mode. The dashed triangles show subthreshold slopes of SS = 60 mV/dec for comparison.

Concretely, the top gate defines a highly doped region in the channel underneath. The distinct doping difference between the gated region and the rest intrinsic part results in a large energy barrier inside the channel. Applying a bottom gate voltage mainly shifts the Fermi level of the intrinsic part. At sufficiently large gate bias, band-to-band tunneling occurs when a proper tunneling window is built up (i.e., the valence band of the intrinsic region aligns with the conduction band of the highly doped gating part for p-type transistor, or vice versa for n-type case). Replacing thermionic emission by the cold carrier injection mechanism of band-to-band tunneling, the device is able to present a low SS that may break the Boltzman tyranny25. We measured the transfer curves of the same transistor configured (by top gate) in different modes. (We have fabricated five devices as summarized in Supplementary Table I and consistently observed similar results). According to the barrier direction, the device can be configured to both p-type and n-type, which is suitable for complementary logic application. The reconfigurable working mechanism is summarized in Supplementary Note 3. The results are compared in Fig. 2e (Vds = 0.1 V, same for the following measurements unless specified). Without top gate, the device is a conventional ambipolar FET. The lowest SS (for one decade increase of source-drain current) is ~300 mV/dec. In contrast, with positive Vtg1 (negative Vtg2), the device is a p-type (n-type) tunneling FET. The lowest room-temperature SS is 48.5 (given in Fig. 2f) and 43 mV/dec (given in Fig. 2g), respectively. It should be noted that due to different contact barrier, electron current is much smaller than the hole current (it also explains the asymmetric transfer curve in Fig. 2d. see Supplementary Note 4 for details). And this asymmetry does influence our results, as we mainly focus on the p-type case which does not suffer from contact problem.

To further confirm the band-to-band tunneling nature of the sharp SS, we performed temperature-dependent transport measurements for the device. Fig. 3a, b summarize the transfer curves at different temperature with and without top gating (positive Vtg1). We also extracted the lowest SS for each curve and plot the results in Fig. 3c. Obviously, without top gate-defined junction, the SS presents a typical thermionic emission feature, that is, linearly grows with increasing temperature. In stark contrast, SS is nearly unchanged with increasing temperature when the channel is top-gated. This temperature-independent switching clearly evidences band-to-band tunneling26,27,28 occurs when a tunnel window is opened by back gate modulation. But owing to some non-ideal effects, it should be noted that the device is likely operated by a tunneling dominated mixed mechanism. For example, under high Vbg bias, the p-n junction barrier may be too low to block all thermal injection. It results in a certain portion of thermal current (rather than a pure tunneling current), especially at high current density case. However, this characteristic does not affect the weak light harnessing proposed in this manuscript.

 

Fig. 3: Band-to-band tunneling properties of the photo-tunneling transistor.

figure 3

ab Temperature-dependent transfer curves for the device configured in tunneling transistor (a) and conventional FET modes (b), Vds = 0.1 V. c Measured lowest SS extracted as functions of temperature. While for conventional FET (red), SS linearly increases with temperature and obeys a thermionic injection rule; the SS of tunneling transistor (black) is temperature independent, exhibiting a band-to-band tunneling nature, the dashed lines are described as indicating the overall trend for visual guidance. d SS as functions of source-drain current extracted from the transfer curves in (a) and (b) measured at T = 250 K.

Figure 3d plots the SS as a function of source-drain current extracted from the transfer curves measured at 250 K. Two major disadvantages of tunneling FET can be clearly identified. Firstly, the SS rapidly degrades with increasing current. The total voltage required to fully switch on the device and thereby the power consumption is still relatively high. Secondly, the ON-state current for a tunneling FET is lower than that of a conventional FET. Fortunately, these disadvantages are no longer critical for sensitive photo-detection, because the device is mainly operated around the lowest SS region for weak-light detection purposes.

Ultra-weak infrared detection of the photo-tunneling transistor

We next move to characterize the turn-on threshold for the photo-tunneling transistor. We extracted the minimum detectable power for mid-wave infrared light (2.5–4.8 μm wavelength) from the transfer curves under dark and different MIR illumination powers. Figure 4a plots the photo-currents as functions of incident MIR light power for the photo-tunneling transistor and conventional FET modes (conventional phototransistor), extracted from Fig. 4b and Supplementary Fig. 6 (Vbg = −0.3 V and −2.5 V for photo-tunneling transistor and conventional FET, respectively. All nearby the lowest SS points where the minimum power is achieved). For comparison, typical detectable threshold powers for recent IR photodetectors15,23,29,30,31,32,33,34,35,36,37 are provided in Supplementary Table 2. The results show that the photo-tunneling transistor significantly improves the turn-on threshold power even with lower responsivity/detectivity.

 

Fig. 4: Photo-response of the photo-tunneling transistor.

figure 4

a Measured photo-current as a function of incident light power for conventional FET (red, Vbg = −2.5 V) and photo-tunneling transistor (black, Vbg = −0.3 V). Inset: enlarged curve at the low power region. b Representative photo-current as a function of incident power and back-gate voltage. The corresponding SS is also shown on the top axis. The white dash-dot indicates the turn-on threshold. cd Photo-current mapping for photo-tunneling transistor (c) and conventional FET (d) under 35 pW light illumination. T = 80 K, Vds = 0.1 V. The photo-tunneling transistor sensitively responds to the light. For comparison, no photo-current is generated in a conventional FET. The dashed lines define different structures of the device. Specifically, yellow dashed lines indicate the top gates (Vtg1 and Vtg2), blue dashed lines indicate the source and drain regions, and the white dashed line indicates the black phosphorus (BP) channel.

To clearly see the difference, we mapped the photo-currents of the device in different modes by a scanning photocurrent microscopy. Figure 4c, d show the representative mapping results excited by 35 pW MIR irradiation. Even with such a weak incident light, a photovoltaic-like response driven by externally applied electric field is apparently observed in the photo-tunneling transistor38. For comparison, no photo-current is generated in the conventional FET. Note that this improvement of threshold cannot be attributed to detectivity enhancement. While the noise figures of the two modes are similar (Supplementary Fig. 7a), the overall responsivity of the photo-tunneling transistor across the entire power range (except around the threshold region) is almost universally lower than that of the FET (Fig. 5a). As a result, although the conventional FET mode is of higher detectivity (Supplementary Fig. 7b), its minimum detectable light power is inferior. This unexpected phenomenon unambiguously highlights the important role played by carrier injection in a photodetector.

 

Fig. 5: Correlation between SS and turn-on threshold light power.

figure 5

a Responsivity extracted from the photo-response measurements for conventional FET (red) and photo-tunneling transistor (black). The photo-tunneling transistor has better threshold power but lower responsivity. b Measured threshold power as a function of temperature for conventional FET (red) and photo-tunneling transistor (black). The curves can be categorized into two different regions, showing the critical role played by charge injection in determining the threshold power. c Transfer curves of the device with different top gate voltages. The SS is continuously tuned by the Vtg1. Grey dashed lines show subthreshold slopes of SS = 60 mV/dec for comparison. Vds = 0.1 V. d Measured threshold power as a function of SS corresponding to the configuration in (c). The dashed lines in (a) and (d) are described as indicating the overall trend for visual guidance.

We finally examine the direct correlation between the turn-on threshold and SS of a photo-transistor. There are two ways to adjust the SS along the carrier injection of photo-transistors. At first, temperature (T) simultaneously influences the thermionic injection rate and noise of photo-transistors. Figure 5b illustrates the temperature-dependent threshold power for photo-tunneling transistor and conventional FET. The curves can be categorized into two intervals. At sufficiently low T (~80–100 K) the threshold power is nearly temperature-independent. And at higher T, the threshold powers exponentially increase. We assign the two intervals as SS-restricted and noise-/noise-SS jointly restricted regions, respectively. In both cases, the photo-tunneling transistor exhibits much better performance (about 30 and 5 times better at 80 K and 300 K).

In addition, the carrier injection rate reflected by SS can be continuously tuned through top gate voltage. Specifically, the band-to-band tunneling current can be described by the Wentzel–Kramer–Brillouin approximation39,40. It is suggested that the tunneling probability relates to the tunneling window, material bandgap, carrier effective mass and screening tunneling length. On one hand, the top gate modifies the tunneling energy barrier and thereby the tunneling window. On the other hand, it also controls the screening tunneling length by changing the spatial charge region across the homojunction. Therefore, it allows to continuously tune the SS through the partial top gate. Figure 5c illustrates the transfer curves under different positive Vtg1 (A similar results were also observed for n-type device under different negative Vtg2, see Supplementary Information note 2 for details). The SS gradually decreases with increasing gating. Figure 5d plots the corresponding turn-on threshold powers. The threshold power exponentially decreases with the SS (T = 80K, where the SS is dominant over noise), verifying carrier injection is the determining factor for the lowest detectable power of a photo-transistor. Interestingly, we found a single photon limit can be theoretically achieved with SS = 5.3 mV/dec by extrapolating the measured curve.

Discussion

In conclusion, we have given an insight into the sensitivity of a photodetector. We unveiled the detect ability or equally the lowest detectable power of phototransistors is not simply a derived parameter from the detectivity, but alternatively determined by charge injection. We demonstrated a strategy of improving the sensitivity by steep-slope FET. Despite the prototypical photo-tunneling transistor presents lowers detectivity, its turn-on threshold power is up to 30 times better than the conventional phototransistor at the same condition. The strategy can be seamlessly extended to various types of steep-slope transistor technique. Fortunately, for the purpose of weak light detection, the sensitivity is immune to most drawbacks of steep-slope transistor, such as high bias voltage, rapidly degraded high-field SS and low ON-state current. Our results clearly indicate the turn-on threshold should be considered as an intrinsic figure of merit in addition to noise and responsivity to gauge the performance of a photo-detector. It also paves a new way for applying steep-slope technique beyond low-power electronics.

Methods

Sample preparation

We used Scotch tape to exfoliate graphene, hBN, and BP onto highly doped silicon substrate (covered by 285-nm-thick SiO2 layer) and polydimethylsiloxane (PDMS) substrate. We identified the thicknesses of graphene (~5 nm as electrode, 15 nm as back gate), hBN (~20 nm as top dielectrics, ~40 nm as top dielectrics), and the BP flakes (<5 nm) with an optical microscope. Graphene/BP heterostructures were fabricated using dry transfer method. The entire fabrication process was carried out in a glovebox in which both the oxygen and the moisture concentrations were well below one part per ten million (0.1 ppm). Electron-beam lithography and electron-beam evaporation were used to fabricate Cr (5 nm)/Au (35 nm) metal electrodes.

Dry transfer method

Firstly, polyvinyl alcohol (PVA) on PDMS was prepared on a supportive glass slide. And then, we contacted the PVA with exfoliated flakes (graphene, hBN, and BP) on silica wafer. The sample was sequentially heated to 80 °C and cooled down to room temperature. We thus lifted the slide and picked up flakes from the wafer with PVA. After aligning the picked-up flakes with another one on the substrate, we slowly lowered the slide again to contact the substrate and repeated the pickup process. Top hBN Graphene electrodes, BP channel, bottom hBN, and graphene back gate were picked one by one. And finally, we placed down the stacked samples on a clean, empty silica wafer and removed the PVA with deionized water.

Optical and transport measurement

The photocurrent mapping and the threshold measurement were performed by self-assembling scanning photocurrent microscopy. In brief, the device was placed in an optical cryostat (Montana S50). A broadband mid-IR super continuum laser (LEUKOS Electro MIR 4.8, 0.8–4.8 μm) was used as a light source. And the light was filtered by a long-pass filter (Thorlabs 2500 nm). We used a ×40/0.5NA reflective microscope objective to focus the filtered beam onto the device. The spot size of the laser was ~9 μm. The laser power was measured by using an optical power meter console (Thorlabs PM100D) equipped with a thermal power sensor (Thorlabs S401C). The photocurrent was collected by a low-noise current preamplifier (Stanford SR570). Photocurrent and dark current were measured directly by the current preamplifier when the light spot was scanned through the device by a galvanometer scanner (Thorlabs GVS011). A series of IR neutral density filters (Edmund 2–16 μm) with optical density ranging from OD 0.3 to 3 were used to control the illumination power. The transport features were measured by a semiconductor analyzer (PDA FS-PRO). Note that, the SS by definition is a derived function (dlogId/dVg). For this reason, we used a 5 mV step. This step size is sufficiently small, as evidenced by the transfer curve, which shows at least three data points even in the sharpest regions.