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    Journals >Laser & Optoelectronics Progress >Volume 52 >Issue 1 >Page 11404 > Article
    • Laser & Optoelectronics Progress
    • Vol. 52, Issue 1, 11404 (2015)
    Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser
    Chen Hua1,*, Xue Shoulong1,2, and Hu Hong2
    Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
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    DOI: 10.3788/lop52.011404 Cite this Article Set citation alerts
    Chen Hua, Xue Shoulong, Hu Hong. Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser[J]. Laser & Optoelectronics Progress, 2015, 52(1): 11404 Copy Citation Text show less
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    Article index updated: Mar. 25, 2025
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    Chen Hua, Xue Shoulong, Hu Hong. Experimental and Theoretical Analysis of Cutting Packaging Materials by Laser[J]. Laser & Optoelectronics Progress, 2015, 52(1): 11404
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