• International Journal of Extreme Manufacturing
  • Vol. 6, Issue 3, 32004 (2024)
Jianlei Cui, Fengqi Wei, and Xuesong Mei*
Author Affiliations
  • State Key Laboratory for Manufacturing Systems Engineering, Xi’an Jiaotong University, Xi’an 710049,People’s Republic of China
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    DOI: 10.1088/2631-7990/ad2e12 Cite this Article
    Jianlei Cui, Fengqi Wei, Xuesong Mei. Carbon nanotube integrated circuit technology: purification, assembly and integration[J]. International Journal of Extreme Manufacturing, 2024, 6(3): 32004 Copy Citation Text show less

    Abstract

    As the manufacturing process of silicon-based integrated circuits (ICs) approaches its physical limit, the quantum effect of silicon-based field-effect transistors (FETs) has become increasingly evident. And the burgeoning carbon-based semiconductor technology has become one of the most disruptive technologies in the post-Moore era. As one-dimensional nanomaterials, carbon nanotubes (CNTs) are far superior to silicon at the same technology nodes of FETs because of their excellent electrical transport and scaling properties, rendering them the most competitive material in the next-generation ICs technology. However, certain challenges impede the industrialization of CNTs, particularly in terms of material preparation,which significantly hinders the development of CNT-based ICs. Focusing on CNT-based ICs technology, this review summarizes its main technical status, development trends, existing challenges, and future development directions.
    Jianlei Cui, Fengqi Wei, Xuesong Mei. Carbon nanotube integrated circuit technology: purification, assembly and integration[J]. International Journal of Extreme Manufacturing, 2024, 6(3): 32004
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