Compensation Design of Interconnection Structure in Optical Module

NING Jing; SONG Xiao-ping; LIU Cheng-gang; YU Chun-ping

doi:10.13756/j.gtxyj.2021.03.011

Journals >Study On Optical Communications >Volume 47 >Issue 3 >Page 48 > Article

Study On Optical Communications
Vol. 47, Issue 3, 48 (2021)

Compensation Design of Interconnection Structure in Optical Module

NING Jing^1,2, SONG Xiao-ping^1,*, LIU Cheng-gang¹, and YU Chun-ping¹

Author Affiliations

¹[in Chinese]

²[in Chinese]

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DOI: 10.13756/j.gtxyj.2021.03.011 Cite this Article

NING Jing, SONG Xiao-ping, LIU Cheng-gang, YU Chun-ping. Compensation Design of Interconnection Structure in Optical Module[J]. Study On Optical Communications, 2021, 47(3): 48 Copy Citation Text

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References

[4] Budka T P.Wide-bandwidth Millimeter-wave Bond-wire Interconnects［J］.IEEE Trans.Microw.Theory Tech.,2001,9( 4):715-718.

[5] Zhang Y P, Li D. Antenna-on Chip and Antenna-in-package Solutions to Highly Integrated Millimeter-wave Devices for Wireless Communications［J］.IEEE Trans. Antenna Propa., 2009,57(10):2830-2841.

[6] Zhang Y P, Sun M, Chua K M, et al. Antenna-in-package Design for Wirebond Interconnection to Highly Integrated 60 GHz Radios［J］.IEEE Trans.Antenna Propa., 2009, 57(10):2842-2852.

NING Jing, SONG Xiao-ping, LIU Cheng-gang, YU Chun-ping. Compensation Design of Interconnection Structure in Optical Module[J]. Study On Optical Communications, 2021, 47(3): 48

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