Xiang-peng OU, Zai-li YANG, Bo TANG, Zhi-hua LI, Jun LUO, Wen-wu WANG, Yan YANG. Silicon Photonic 2.5D/3D Integration Technology and Its Applications[J]. Study On Optical Communications, 2023, 49(1): 1
- Study On Optical Communications
- Vol. 49, Issue 1, 1 (2023)
Fig. 1. Application of silicon-based photonics
![The number of photonic components integrated in a single PIC on three different platforms over time[22]](/richHtml/gtxyj/2023/49/1/1/1005-8788-00-01-001-F002.jpg)
Fig. 2. The number of photonic components integrated in a single PIC on three different platforms over time[22]
Fig. 3. Development trend of silicon-based photonic integration technology
Fig. 4. Silicon-based photonic integration structure
Fig. 5. 2D integrated silicon-based photonic chip
Fig. 6. High-speed integrated silicon optical transceiver chip
Fig. 7. 2.5D integrated silicon photonic chip
Fig. 8. 3D integrated silicon photonic chip
Fig. 9. Monolithically integrated silicon photonic chip
Fig. 10. Silicon photonic LiDAR based on OPA
Fig. 11. Silicon photonic neural network chip
Fig. 12. Sensors based on silicon-based optoelectronic platform
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Table 1. Silicon photonic chips based on four different integration technologies for communication
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