• Study On Optical Communications
  • Vol. 46, Issue 4, 58 (2020)
NIE Guo-jian, YU Di*, LEI Ting, LI Xin-rong, and YANG Yun
Author Affiliations
  • [in Chinese]
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    DOI: 10.13756/j.gtxyj.2020.04.012 Cite this Article
    NIE Guo-jian, YU Di, LEI Ting, LI Xin-rong, YANG Yun. Study on Reliability of Photoelectric Structure in Flexible Printed Circuit Board under Thermal Stress[J]. Study On Optical Communications, 2020, 46(4): 58 Copy Citation Text show less
    References

    [1] Tao Q, Luo F, Cao L, et al. Relative Power Loss of Misalignment based on Electro-optical Printed Circuit Board[J]. Optik-International Journal for Light and Electron Optics, 2011, 122(18): 1603-1606.

    [2] Tao Q, Luo F, Zhang J, et al.Analysis of Fabrication Tolerance based on Uneven Thickness of Su8-Photo-Resist[J].Journal of Optical Technology, 2013, 80(5): 329-331.

    [3] Bamiedakis N, Hashim A, Beals J, et al. Low-Cost PCB-Integrated 10-Gb/s Optical Transceiver Built with a Novel Integration Method[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 3(4): 592-600.

    [4] He H M, Liu F M, Xue H Y, et al. Fabrication and Performance Analysis of a High Coupling Efficiency and Convenient-integration Optical Transceiver[J]. Optoelectronics Letters, 2017, 13(4): 250-253.

    [6] Cheng L, Zhou D J, Wu Z H. Analysis on Random Vibration Response of Photoelectric PCB[J]. Transactions of Beijing Institute of Technology, 2017, 37(6): 631-636.

    [9] Herkommer D, Punch J, Reid M. A Reliability Model for SAC Solder Covering Isothermal Mechanical Cycling and Thermal Cycling Condition[J]. Microelectronics Reliability, 2010, 50(1): 116-126.

    NIE Guo-jian, YU Di, LEI Ting, LI Xin-rong, YANG Yun. Study on Reliability of Photoelectric Structure in Flexible Printed Circuit Board under Thermal Stress[J]. Study On Optical Communications, 2020, 46(4): 58
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