Jiandong MAO, Guohua XIAO, Zijun ZHENG. Thermal Simulation and Experimental Study of QSFP＋ Optical Modules[J]. Study On Optical Communications, 2025, 51(1): 230172-01
- Study On Optical Communications
- Vol. 51, Issue 1, 230172-01 (2025)
Fig. 1. The 3D model of optical module
Fig. 2. Main chip locations and power consumption on the the PCB
Fig. 3. Numerical wind tunnel model
Fig. 4. Overall temperature field distribution of optical module
Fig. 5. Actual test plan
Fig. 6. Schematic diagram of the measured structure
Fig. 7. The physical diagram of the experiment
Fig. 8. Comparison of simulation and measured data
Fig. 9. Comparison of simulated temperature rise and measured temperature rise
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Table 1. Material properties
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