An optimum packaging structure of photoconductive infrared detector which is a 7-channel device and made in the form of linear array was proposed. After a brief introduction to the basic elements in dewar assembly, the development of dewar assembly at home and abroad was reviewed by examining the assembly design. Based on the review of previous work, the performances of three different designs were compared: the first design provided direct electronic feed-through and contacted points with a number of cables and wire feeds, yet fails to a significant increase in the size of the device; the second one adopted Ceramic Pin Grid Array as the package, however this design was unavailable due to the lack of the optimal contact points; the third design absorbed the idea of “time-sharing” with both thick film and thin film technology. Furthermore, the third one of an innovative cabling solution enabled the infrared detect or to offer high performance and good response speed by using flexible cables.