The performance of small-volume surface acoustic wave (SAW) filters is significantly affected by packaging. To solve this problem, a new SAW trapezoidal filter circuit topology is proposed. By analyzing the phenomenon of the upturn of the remote rejection caused by the packaging of the filter at high frequency, the layout design is changed from the circuit structure to realize the on-chip inductance. The circuit topology that combines the conventional trapezoidal filter structure with the special grounding structure of the longitudinally coupled dual-mode resonator type filter (DMS) contributes to out-of-band rejection and design flexibility. The optimal topology of the high-order RF SAW filter with a center frequency of 2 580 MHz, bandwidth of 50 MHz, and an insertion loss of less than 2.5 dB is obtained via simulation analysis on a standard 42°Y-X lithium tantalate (LiTaO3) substrate.