The low temperature deformation and micro-vibration displacement of the coupling interface of large-scale infrared focal plane (such as large array and long line array) are comprehensively evaluated to ensure that the chip deformation, stress and pixel displacement at low temperature can meet the application requirements after the coupling of focal plane detector. The point sampling of the infrared focal plane of a certain model at 80 K operating temperature is carried out by the conjugated microscopic system to obtain a multi-point three-dimensional coordinate system, and then the plane fitting of the coordinate system is carried out to obtain the low-temperature deformation and micro-vibration displacement of the focal plane. The low temperature deformation of the infrared focal plane is 18 μm by simulation and 19 μm by measurement. The deduced value of micro-vibration displacement is 0.7 μm, and the measured result is 0.9 μm. Both measured values meet the index requirements. The image of this model of infrared camera is clear in orbit and rich in layers, which indicates that the method is more realistic and effective to evaluate the low temperature deformation and micro-vibration displacement of the coupled interface, and can provide reliable and effective guarantee for the subsequent model projects.