The 808 nm high-power semiconductor laser bars are used for packaging to optimize the two important factors that affect the package quality: the furnace tube temperature and the soldering time. The results show that the solder layer has the least voids when the soldering time is 100 s at a tube furnace temperature of 650 ℃. Moreover, the obtained semiconductor laser bar has the lowest smile effect value, the smallest threshold current, a more stable wavelength, and the best soldering quality.