At present the optical module package types have been changed gradually from small form-factor pluggable (SFP) series to centum form-factor pluggable (CFP) and quad SFP (QSFP) series. Transmission rate is up to 400 Gb/s. Transmitting lasers′extinction ratio (ER) is more than 9 dB. Optical wavelength division multiplexers′insert loss (IL) is less than 1 dB. Transmitting power is more than 0.3 dBm. Receiving detector′s responsivity is 0.7 A/W and receiving sensitivity is less than -17 dBm. Transmitting and receiving integrated chips in the data center, which can be applied on the 40/100 GbE, standardized as IEEE 802.3 ba, is demonstrated, including the discrete devices assembly chip, hybrid integration chip and monolithic integration chip, whose basic structures and characteristics are introduced as well.