The infrared detector frame gluing process has the characteristics of many types of adhesives and high requirements for gluing accuracy. It is difficult to take into account the process efficiency and process effect at the same time. In order to explore a better gluing process, the effects of two gluing processes, manual gluing and silk printing, on the bonding of frames and chips are compared and analyzed based on the same frame. The results show that both silk printing and manual gluing can meet the basic requirements of adhesive curing, resistance to 100 times of temperature shock test and uniform overflow around the circuit chip. When the screen is in the concentrated punch mode, the void fraction of silk printing in the adhesives between the circuit chip and frame is less than 1%, which is 009 times that of manual gluing. When using different adhesives, the effect of the manual gluing process is not affected by the change of the filler diameter of the adhesive, while silk printing is more suitable for adhesives with small diameter fillers. Finally, according to the iterative data of silk printing plates, the empirical calculation formula of missing printing area is proposed, which provides support for accurate and fast screen plate design.