The yield of curve-shape arrayed waveguide grating (AWG) chips is twice of the square-shape ones. However, the center wavelength of curve-shape AWG is easily influenced by the packaging stress, which is introduced by the linear expansion coefficient difference between the packaging box and the ribbon fibers coupled to the AWG chip. The experimental results showed the AWG center wavelength varied with the thermal stress linearly. The variation of the center wavelength for a thermally stabled AWG module was as large as 46 pm, when the ambient temperature varied from －20 ℃ to 65 ℃, even the ribbon fibers were bonded to the packaging box with soft silicon rubber. In this paper, a new low stress thermal stabled AWG packaging was introduced. In this package, a borosilicate glass plate was bonded to the ceramic heater, and the ribbon fibbers were bonded to it with silicon rubber. For the linear expansion coefficient difference between the borosilicate glass plate and ribbon fiber is very samll, the thermal stress of ribbon fibber or AWG chip is very small. Experimental results showed the typical center wavelength variation for thermally stabled AWG modules manufactured with this technique was smaller than 5 pm, and the typical thermal stress was smaller than 0.029 MPa, when the ambient temperature varied from －20 ℃ to 65 ℃.