Jiayi Wang, Zhongxing Duan. Infrared Thermal Imaging Detection of Surface Cracks in External Insulation Layer of Building Exterior Wall[J]. Laser & Optoelectronics Progress, 2022, 59(22): 2204001
- Laser & Optoelectronics Progress
- Vol. 59, Issue 22, 2204001 (2022)
Fig. 1. Three-dimensional model of infrared thermal imaging detection for polystyrene foam board. (a) Overall schematic of polystyrene foam board; (b) model meshing
Fig. 2. Defect detection system of infrared thermal imaging
Fig. 3. Field test results. (a) Material for field experiments; (b) infrared thermography
Fig. 4. Infrared thermograms of on-site detection at different time. (a) 8∶00; (b) 12∶00; (c) 16∶00
Fig. 5. Comparison of measured and calculated values at different thicknesses. (a) 0-mm thick crack; (b) 5-mm thick crack; (c) 10-mm thick crack
Fig. 6. Relationship between crack width and maximum temperature difference under different thickness
Fig. 7. Relationship between crack thickness and maximum temperature difference under different width
Fig. 8. Relationship between crack width and maximum temperature difference under different ambient temperature conditions. (a) 5-mm thick crack; (b) 10-mm thick crack; (c) 20-mm thick crack
Fig. 9. Relationship between crack thickness and maximum temperature difference under different ambient temperature conditions. (a) 20-mm wide crack; (b) 40-mm wide crack; (c) 60-mm wide crack
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Table 1. Main thermodynamic parameters of polystyrene foam board
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Table 2. Calculation results of maximum temperature difference between crack and non-crack areas of insulation layer under different working conditions
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