In the repair process of some types of equipment, the equipment must be disassembled and the faulty parts must be replaced before reassembly. Many types of adhesives are used when such equipment is manufactured, which should be removed during the repair process. Once repairing is completed, the equipment should be assembled and sealed using the necessary adhesives. In the current repair technology, adhesive removal is entirely artificial, which is inefficient and the effect is unideal. Laser cleaning technology is a new surface cleaning technology that shows high cleaning efficiency and accuracy and has been successfully used in the cleaning of oxides on metal surfaces, aircraft skins, semiconductor wafers, and other applications. This study examines the feasibility of applying the laser cleaning technology to some types of equipment repair. Moreover, the cleaning efficiencies and effects of different substrate materials, different adhesives, and different laser pulse energies are compared. Results show that the laser cleaning technology can remove adhesives from metal and glass surfaces but can cause irreversible damage to wood and circuit board surfaces.