Jiachao Xi, Dong Zhi, Yanxing Ma, Lei Si. Coherent Beam Combining Based on High Filling Factor Array with New Sub-Aperture Shape[J]. Laser & Optoelectronics Progress, 2019, 56(4): 041401

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- Laser & Optoelectronics Progress
- Vol. 56, Issue 4, 041401 (2019)

Fig. 1. Three filling schemes with different sub-aperture shapes. (a) Circle; (b) hexagon; (c) combination

Fig. 2. Relationship between transmission power ratio and truncation coefficient. (a) Hexagon; (b) cut sector

Fig. 3. Relationship between BPF and truncation coefficient for splicing schemes with different shapes

Fig. 4. Near-field and far-field patterns simulated based on three sub-aperture splicing schemes. (a) Near-field pattern for 7 circles; (b) near-field pattern for 7 hexagons; (c) near-field pattern for 7 combination; (d) 3D far-field pattern for 7 circles; (e) 3D far-field pattern for 7 hexagons; (f) 3D far-field pattern for 7 combination; (g) 2D far-field pattern for 7 circles; (h) 2D far-field pattern for 7 hexagons; (i) 2D far-field pattern for 7 combination

Fig. 5. Light intensity distribution along x-axis of far-field pattern center
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Table 1. Simulation parameters
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Table 2. Simulation results

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