Yanguo SONG, Xu GUO, Yanluan WANG, Qiang HAO. Research on stealth dicing silicon carbide wafer by picosecond laser pulses[J]. Optical Instruments, 2022, 44(3): 88
- Optical Instruments
- Vol. 44, Issue 3, 88 (2022)
Fig. 1. Experimental setup
Fig. 2. Laser parameters
Fig. 3. Cutting results of Laser1
Fig. 4. Cutting results of Laser2
Fig. 5. Wafer surface results of 25 μm focal depth laser
Fig. 6. Wafer surface results of 20 μJ single-pulse-laser was focused at different depths
Fig. 7. Cross-section of the slice
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