Researching

Journals
  • Advanced Photonics
  • Photonics Insights
  • Advanced Photonics Nexus
  • Photonics Research
  • Advanced Imaging
  • View All Journals
  • Chinese Optics Letters
  • High Power Laser Science and Engineering
    • Articles
  • Optics
  • Physics
  • Geography
  • View All Subjects
    • Conferences
  • CIOP
  • HPLSE
  • AP
  • View All Events
    • News
    About CLP
    Search by keywords or author
    Journals >Optics and Precision Engineering >Volume 12 >Issue z1 >Page 272 > Article
    • Optics and Precision Engineering
    • Vol. 12, Issue z1, 272 (2004)
    Research on hot embossing and thermal bonding for fabrication of PMMA microfluidic chips
    1, 2, 1, and 1
    Author Affiliations
  • 1[in Chinese]
  • 2[in Chinese]
    • show less
    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Research on hot embossing and thermal bonding for fabrication of PMMA microfluidic chips[J]. Optics and Precision Engineering, 2004, 12(z1): 272 Copy Citation Text show less

    Abstract

    Abstract
    Get PDF
    Figures&Tables (0)
    Equations (0)
    References (8)
    Get Citation
    Copy Citation Text
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Research on hot embossing and thermal bonding for fabrication of PMMA microfluidic chips[J]. Optics and Precision Engineering, 2004, 12(z1): 272
    Download Citation
    Tools
    Share
    Save the article for my favorites
    Paper Information
    Recommended Topics
    laser devices and laser physics
    Lasers and Laser Optics
    Laser physics
    laser manufacturing
    Instrumentation, Measurement and Metrology