The surface of the indium antimonide focal plane device is often marked with fine lines after the traditional backside thinning process; when the traditional surface cleaning method is used, it is also easy to cause scratches on the surface of the device, resulting in poor process repeatability. Therefore, when the device is thinned on the back surface, the corrosion liquid is used to remove the scratches, and the non-contact cleaning method based on petroleum ether and absolute ethanol is adopted, which effectively reduces the probability of scratches on the surface of the device and avoids the higher level of some areas during the test due to the uneven surface corrosion rate, bright spots on the test image, etc. In addition, the process repeatability is improved, and the infrared imaging of the indium antimonide device is uniform and there is no scratch, thereby improving the yield of the device.