According to the requirements of the current cooled infrared focal plane array (IRFPA) detector for the cooling start-up time (quick start), the specific factors that affect the start-up time of the detector are analyzed. The results show that the cooling rate of the cold platform parts has a certain degree of influence on the start-up time of the detector. The current domestic thermal conductivity materials are investigated. A material matching the infrared detector hybrid chip is found, and the preliminary process of the material is verified.