• Optics and Precision Engineering
  • Vol. 22, Issue 11, 2923 (2014)
ZHOU Yan-zhou*, LIU Yun-hong, LIU Yu-fei, XU Jin-xiong, and ZHANG Yun
Author Affiliations
  • [in Chinese]
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    DOI: 10.3788/ope.20142211.2923 Cite this Article
    ZHOU Yan-zhou, LIU Yun-hong, LIU Yu-fei, XU Jin-xiong, ZHANG Yun. Measurement of compression displacement fields in dual layer epoxy composites by interferometry[J]. Optics and Precision Engineering, 2014, 22(11): 2923 Copy Citation Text show less

    Abstract

    A tilt depth-resolved wavenumber-scanning Michelson interferometer was built up to measure and analyze the compression displacement field distributions on the fore, middle and rear surfaces of dual layer epoxy composites. A Distribution Feedback(DFB) diode laser whose wavenumber could be modulated by the temperature was used to perform the wavenumber-scanning interferometric measurement for the dual layer epoxy composites. A Random-Sampling Fourier Transform (RSFT) was designed to evaluate the phase differences of the dual layer epoxy composite samples before and after applying loads. Finally, the unwrapping algorithm was used to unwrap the phase differences for the samples before and after applying loads and the compression displacement field distributions of every surfaces on or inside the epoxy composites were given out. Experimental results indicate that measurement resolutions of the compression displacement field distribution are ±100 nm, and the profile resolution in depth and the maximum measurement depth are 0.41 mm and 52 mm, respectively. This method accurately measures the compression displacement field distribution, and its measurement is independent on the internal plane elastic modulus size of resin matrix composites. It is characterized by higher measuring accuracy, stable system and stronger resisting disturbance.
    ZHOU Yan-zhou, LIU Yun-hong, LIU Yu-fei, XU Jin-xiong, ZHANG Yun. Measurement of compression displacement fields in dual layer epoxy composites by interferometry[J]. Optics and Precision Engineering, 2014, 22(11): 2923
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