• Optics and Precision Engineering
  • Vol. 16, Issue 4, 689 (2008)
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  • [in Chinese]
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    DOI: Cite this Article
    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 2008, 16(4): 689 Copy Citation Text show less

    Abstract

    [in Chinese], [in Chinese], [in Chinese], [in Chinese]. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 2008, 16(4): 689
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