[in Chinese], [in Chinese], [in Chinese], [in Chinese]. Effect of retaining ring on pressure distribution and profile of polishing wafer surface[J]. Optics and Precision Engineering, 2008, 16(4): 689

Search by keywords or author
- Optics and Precision Engineering
- Vol. 16, Issue 4, 689 (2008)
Abstract

Set citation alerts for the article
Please enter your email address