• Optical Instruments
  • Vol. 44, Issue 5, 53 (2022)
Chenxin JIA, Rongfu ZHANG*, Mengyuan REN, Zhaohui XU..., Yangdan GONGJI and Hanlin LIU|Show fewer author(s)
Author Affiliations
  • School of Optical-Electrical and Computer Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
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    DOI: 10.3969/j.issn.1005-5630.2022.005.007 Cite this Article
    Chenxin JIA, Rongfu ZHANG, Mengyuan REN, Zhaohui XU, Yangdan GONGJI, Hanlin LIU. An endoscope welding spot detection system based on FPGA image processing[J]. Optical Instruments, 2022, 44(5): 53 Copy Citation Text show less
    References

    [1] BUNYAK F, ERCAL F. Inspection of power ground layers in PCB images[C]Proceedings of SPIE 3521, Machine Vision Systems f Inspection Metrology VII. Boston, United States: SPIE, 1998: 190197.

    [2] MAR N S S, YARLAGADDA P K D V, FOOKES C. Design and development of automatic visual inspection system for PCB manufacturing[J]. Robotics and Computer-Integrated Manufacturing, 27, 949-962(2011).

    Chenxin JIA, Rongfu ZHANG, Mengyuan REN, Zhaohui XU, Yangdan GONGJI, Hanlin LIU. An endoscope welding spot detection system based on FPGA image processing[J]. Optical Instruments, 2022, 44(5): 53
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