Extreme ultraviolet lithography (EUVL) has become the key candidate of lithography tools to manufacture devices at the 22 nm node and beyond of semiconductor integrated circuit, which makes use of the extreme ultraviolet rays with 13.5 nm wavelength as the light source. It is one of approaches to construct a normal incidence optical system by using the excellent performance multilayer coatings. A review was given of the specification of the coatings for EUVL and the recent progress in multilayered systems. The key deposition methods and equipments that produce such coatings were discussed. Furthermore, in terms of high reflectance, wavelength matching, profile matching, life and stability, it also concludes the problems existed in the preparation technologies of the multilayered systems and the future development direction.