• Optoelectronic Technology
  • Vol. 41, Issue 3, 175 (2021)
Shuyi LIU1, Bingchen YANG2, Guozheng WANG1, Lianyu LI1, and Zhusong JIANG1
Author Affiliations
  • 1School of Science, Changchun University of Science and Technology, Changchun 30022, CHN
  • 2The 55th Research Institute of China Electronic Technology Group Corporation,Nanjing 10016, CHN
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    DOI: 10.19453/j.cnki.1005-488x.2021.03.003 Cite this Article
    Shuyi LIU, Bingchen YANG, Guozheng WANG, Lianyu LI, Zhusong JIANG. Fabrication of Optical Fiber Panel Based on Silicon Microchannel Array[J]. Optoelectronic Technology, 2021, 41(3): 175 Copy Citation Text show less
    Structure of optical fiber panel based on silicon microchannel array
    Fig. 1. Structure of optical fiber panel based on silicon microchannel array
    Principle of total reflection light transmission of optical fiber panel based on silicon microchannel array
    Fig. 2. Principle of total reflection light transmission of optical fiber panel based on silicon microchannel array
    Fabrication process of silicon microchannel array
    Fig. 3. Fabrication process of silicon microchannel array
    SEM images of the prepared silicon microchannel array
    Fig. 4. SEM images of the prepared silicon microchannel array
    Schematic of filling device
    Fig. 5. Schematic of filling device
    Temperature-rising and temperature-falling curves
    Fig. 6. Temperature-rising and temperature-falling curves
    Photograph and cross-sectional SEM image of optical fiber panel
    Fig. 7. Photograph and cross-sectional SEM image of optical fiber panel
    Image captured during the resolution test
    Fig. 8. Image captured during the resolution test
    名称

    折射

    密度/

    (g·cm-3)

    热容/

    J·(g·K)-1

    转变温度/(℃)退火点/(℃)软化点/(℃)
    P⁃SF682.00526.190.37428430504
    Table 1. Performance parameters of filling material
    Shuyi LIU, Bingchen YANG, Guozheng WANG, Lianyu LI, Zhusong JIANG. Fabrication of Optical Fiber Panel Based on Silicon Microchannel Array[J]. Optoelectronic Technology, 2021, 41(3): 175
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