[3] PAO Yih-hsing.Dynamical stress concentration in an elastic plate[J].Journal of Applied Mechanics,1962,29(2):299-305.
[5] LI Zhan-wen,TAO Ming,DU Ku,et al.Dynamic stress state around shallow-buried cavity under transient P wave loads in different conditions[J].Tunnelling and Underground Space Technology,2020,97(Mar.):103228.1-12.
[8] A Ghafarollahi,H M Shodja.Scattering of SH-waves by an elliptic cavity/crack beneath the interface between functionally graded and homogeneous half-spaces via multipole expansion method[J].Journal of Sound and Vibration,2018,435:372-389.
[9] TAO M,ZHAO R,DU K,et al.Dynamic stress concentration and failure characteristics around elliptical cavity subjected to impact loading[J].International Journal of Solids and Structures,2020,191-192:401-417.
[10] LEE V W,KARL J.On deformation near a circular underground cavity subjected to incident plane P waves[J].European Journal of Earthquake Engineering,1993,11:29-36.
[11] YI C,ZHANG P,JOHANSSON D,et al.Dynamic response of a circular lined tunnel with an imperfect interface subjected to cylindrical P-waves[J].Computers and Geotechnics,2014,55:165 171.
[12] YI C P,LU W B,ZHANG P,et al.Effect of imperfect interface on the dynamic response of a circular lined tunnel impacted by plane P-waves[J].Tunn Undergr Space Technol,2016,51:68-74.
[14] MD Trifunac.Surface motion of a semi-cylindrical alluvial valley for incident plane SH waves[J].Bulletin of the Seismological Society of America,1971,61(6):1755-1770.
[21] ROKHLIN S I.Analysis of boundary conditions for elastic wave interaction with an interface between two solids[J].Journal of the Acoustical Society of America,1991,89(2):503-515.
[22] J P Jones,J S Whittier.Wave in flexibly bonded interface[J].J Appl Mech,1967,34(4):905-909.
[23] M Rajabi,SEYYED M,HASHEMINEJAD.Acoustic resonance scattering from a multilayered cylindrical shell with imperfect bonding[J].Ultrasonics,2009,49(8):682-695.
[24] RICKER Norman.The form and nature of seismic waves and the structure of seismograms[J].Geophysics,2002,5(4):348-366.
