Chupeng Zhang, Linxiao Yang, Han Xu, Jiazheng Sun, Yingxue Li, Xiao Chen. Development and Application of Chemical Mechanical Polishing Surface-Pressure Distribution Detection Device Based on Thin-Film Sensors[J]. Laser & Optoelectronics Progress, 2023, 60(15): 1512002
- Laser & Optoelectronics Progress
- Vol. 60, Issue 15, 1512002 (2023)
Fig. 1. CMP system schematic diagram
Fig. 2. Motion relation diagram
Fig. 3. Contact pressure model of point N
Fig. 4. Contact diagram of workpiece and plate
Fig. 5. Resistive strain gauge layout
Fig. 6. Thin-film piezoresistive sensor patch layout
Fig. 7. Acquisition system hardware diagram
Fig. 8. Schematic diagram of pressure distribution in-situ detection device
Fig. 9. Cloud map without pressure
Fig. 10. Cloud map with single weight
Fig. 11. Calibration experiment diagram
Fig. 12. Pressure-load curve
Fig. 13. Simulation results. (a) Stress distribution; (b) stress distribution along the radial direction
Fig. 14. Change of pressure distribution with increasing load
Fig. 15. Change of contact status with increasing load (a) Contact pressure distribution under small load; (b) contact pressure distribution under large load
Fig. 16. Grinding experiment platform
Fig. 17. Experimental data acquisition path
Fig. 18. Change in pressure distribution under different loads during grinding
Fig. 19. Change of polishing pad surface shape with increasing grinding time
Fig. 20. Change of mean and standard deviation of pressure with increasing grinding time
Fig. 21. Change of pressure distribution on path 1 and path 2 with grinding time. (a) 5 kg; (b) 6 kg; (c) 7 kg
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Table 1. Simulation model material parameters and geometric dimensions
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