InGaAs single-photon detectors are extensively used in laser 3D imaging, long-distance high-speed digital communication, free-space optical communication, and quantum communication. Different packaging formats, including coaxial packaging, butterfly packaging, and pin grid array packaging, have been designed for unit, line array, and small panel array devices. The impact of the temperature on the efficacy of InGaAs single-photon devices and the methodologies for controlling component temperature are discussed. Detailed comparisons and analyses of high-precision coupling methods for optical components such as microlenses, lenses, optical fibers, etc. to the semiconductor are provided. For high-frequency signal output, the lead type, wiring method, packaging structure design, and other issues are reviewed, and the development trend of the InGaAs single-photon detectors is forecasted.