Fuxin PENG, Zhongwei HU, Yu CHEN, Binhui XIE, Zhihao ZHOU. Surface crack depth detection of sapphire substrate two-sided lapping[J]. Optics and Precision Engineering, 2023, 31(14): 2060
- Optics and Precision Engineering
- Vol. 31, Issue 14, 2060 (2023)
Fig. 1. Double side grinding machine
Fig. 2. Section microscopic observation method sample
Fig. 3. Principle of Focused Ion Beam Side Observation
Fig. 4. High temperature etching machine
Fig. 5. Grinding sapphire substrate etching rate curve
Fig. 6. Magnetorheological polishing sapphire substrate
Fig. 7. Magnetorheological polishing spot midline contour curve
Fig. 8. CMP Polishing machine
Fig. 9. Polishing cross section cracks on double side grinding sapphire substrate
Fig. 10. Cross section crack of focused ion beam in double side polished sapphire wafer
Fig. 11. Differential etching rate curve of grinding sapphire
Fig. 12. Surface morphology changes of sapphire after grinding for 30-40 min
Fig. 13. Surface morphology of different points on the midline of polishing spot
Fig. 14. Surface morphology of polished sapphire layer by layer
Fig. 15. Models of surface and subsurface cracks on double-sided grinding sapphire substrate
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Table 1. Crack depth measured by different methods
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