HgCdTe FPA pixel performance of high-reliability and long-life is worse, degraded and failed over time in service life. To determine its storage life, the test time should be shortened by class B test, the constant stress of ALT or ADT should be greater than that of high temperature ＋90 ℃,2 160 h. The high acceleration stress screening test HASS should be forced to develop the defect to expose the possible early failure before the quantitative acceleration test. According to the high temperature storage test performance degradation test data of the HgCdTe FPA Dewar assembly, the statistical model was used to convert the failure time or performance parameter degradation characteristics. The storage life was greater than 50 years under rated stress level st ＋25 ℃. More than 3 000 h the high temperature storage test results show that the pixel performance tends to be better before 1 500 h because residual technological stress is released. Baking for 20 days in a vacuum environment of high temperature ＋80 ℃ does not cause deterioration of pixel performance.