Densification of ceramic materials by conventional sintering process usually requires a high temperature over 1000 ℃, which not only consumes a lot of energy, but also forces some ceramic materials to face challenges in phase stability, grain boundary control, and co-firing with metal electrodes. In recent years, an extremely low temperature sintering technique named cold sintering process (CSP) was proposed, which can reduce the sintering temperature to below 400 ℃, and realize the rapid densification of ceramic materials through the dissolution- precipitation process of ceramic particles by using the transient solvent in liquid phase and uniaxial pressure. The advantages of CSP, including low sintering temperature and short sintering time, have attracted extensive attention from researchers, since it was firstly reported in 2016. At present, CSP has been applied to the sintering of nearly 100 kinds of ceramics and ceramic-matrix composites, involving dielectric materials, semiconductor materials, pressure-sensitive materials, and solid-state electrolyte materials. This paper firstly introduces the low-temperature sintering techniques’ development history, process and densification mechanism. Then, application of CSP in the field of ceramic materials and ceramic-polymer composites is summarized. Based on differences of solubility, application of CSP mainly on Li₂MoO₄ ceramics, ZnO ceramics, BaTiO₃ ceramics, and their composites preparations are introduced. Auxiliary effect of the transient solvent on cold sintering process is emphatically analyzed. Moreover, the high pressure issue in the cold sintering process and the possible solutions are discussed. At last, future development trend of cold sintering process is prospected.