• Journal of Inorganic Materials
  • Vol. 39, Issue 6, 634 (2024)
Weiming WANG1, Weide WANG1,2,*, Yi SU1, Qingsong MA1..., Dongxu YAO3 and Yuping ZENG3,*|Show fewer author(s)
Author Affiliations
  • 11. Science and Technology on Advanced Ceramic Fibers and Composites Laboratory, College of Aerospace Science and Engineering, National University of Defense Technology, Changsha 410073, China
  • 22. College of Advanced Interdisciplinary Studies, National University of Defense Technology, Changsha 410073, China
  • 33. Shanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
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    DOI: 10.15541/jim20230530 Cite this Article
    Weiming WANG, Weide WANG, Yi SU, Qingsong MA, Dongxu YAO, Yuping ZENG. Research Progress of High Thermal Conductivity Silicon Nitride Ceramics Prepared by Non-oxide Sintering Additives[J]. Journal of Inorganic Materials, 2024, 39(6): 634 Copy Citation Text show less
    Schematic of typical packaging of power semiconductor device[1]
    1. Schematic of typical packaging of power semiconductor device[1]
    Schematic of the liquid phase sintering mechanism for Si3N4 ceramics[10]
    2. Schematic of the liquid phase sintering mechanism for Si3N4 ceramics[10]
    Effects of volume fraction of glassy phase, grain- boundary film thickness(δ), and grain size on the thermal conductivity of β-Si3N4[13]
    3. Effects of volume fraction of glassy phase, grain- boundary film thickness(δ), and grain size on the thermal conductivity of β-Si3N4[13]
    Effect of lattice oxygen content on the thermal conductivity of Si3N4 ceramics[17]
    4. Effect of lattice oxygen content on the thermal conductivity of Si3N4 ceramics[17]
    Displacement-temperature curves of Si3N4 ceramics with MgF2 or MgO as sintering additives[19]
    5. Displacement-temperature curves of Si3N4 ceramics with MgF2 or MgO as sintering additives[19]
    XRD patterns of Si3N4 samples prepared with different LiF contents[20]
    6. XRD patterns of Si3N4 samples prepared with different LiF contents[20]
    Depolymerization mechanism of F atom in silicate melts[22]
    7. Depolymerization mechanism of F atom in silicate melts[22]
    SEM morphologies of the polished surfaces of Si3N4 ceramics after gas pressure sintering (GPS) with different additives added[24]
    8. SEM morphologies of the polished surfaces of Si3N4 ceramics after gas pressure sintering (GPS) with different additives added[24]
    Typical HRTEM images of Si3N4 ceramics added with Y2O3 (a) and Y2Si4N6C (b) as additives[31]
    9. Typical HRTEM images of Si3N4 ceramics added with Y2O3 (a) and Y2Si4N6C (b) as additives[31]
    Curves of relative displacement of the as-pressed specimens with temperature variation[32]
    10. Curves of relative displacement of the as-pressed specimens with temperature variation[32]
    Densification mechanism of Si3N4 ceramics with ZrSi2-MgO additive[36]
    11. Densification mechanism of Si3N4 ceramics with ZrSi2-MgO additive[36]
    Shrinkage curves of the Si3N4 ceramics[10]
    12. Shrinkage curves of the Si3N4 ceramics[10]
    Schematic illustration of Si3N4-Y2O3-SiO2 phase at 1900 ℃[10]
    13. Schematic illustration of Si3N4-Y2O3-SiO2 phase at 1900 ℃[10]
    STEM-EDS characterizations of Si3N4 ceramics with the addition of ZrO2 and ZrH2[47]
    14. STEM-EDS characterizations of Si3N4 ceramics with the addition of ZrO2 and ZrH2[47]
    SEM images on the fracture surfaces of nitrided samples (a, b) and post-sintered samples (c, d) without (a, c) and with (b, d) graphite powder bed addition[57]
    15. SEM images on the fracture surfaces of nitrided samples (a, b) and post-sintered samples (c, d) without (a, c) and with (b, d) graphite powder bed addition[57]
    TEM images of PDA-coated powder and schematic of Si3N4-C core-shell structure[59-60]
    16. TEM images of PDA-coated powder and schematic of Si3N4-C core-shell structure[59-60]
    (a) Shrinkage behaviors and densification mechanism of Si3N4 ceramics during sintering, and (b) relationship between β phase ratio and relative density[62]
    17. (a) Shrinkage behaviors and densification mechanism of Si3N4 ceramics during sintering, and (b) relationship between β phase ratio and relative density[62]
    Evolution of microstructure and diameter of Si3N4 ceramics[10]
    18. Evolution of microstructure and diameter of Si3N4 ceramics[10]
    MaterialThermal conductivity/(W·m-1·K-1) Fracture toughness/(MPa·m1/2) Bending strength/MPa
    Al2O318-243.5-4.0300-400
    AlN150-2703.0-3.5220-310
    ZTA284.5650
    Si3N480-1776.5-7.5600-800
    Table 1. Properties of ceramic substrate materials[2]
    Weiming WANG, Weide WANG, Yi SU, Qingsong MA, Dongxu YAO, Yuping ZENG. Research Progress of High Thermal Conductivity Silicon Nitride Ceramics Prepared by Non-oxide Sintering Additives[J]. Journal of Inorganic Materials, 2024, 39(6): 634
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