The falling ball impact strength is a critical indicator of mechanical properties of electronic substrate glass, significantly influenced by residual stress. This study employed finite element methods to numerically simulate the falling ball impact strength of electronic substrate glass under varying residual stress distribution patterns, paralleled with actual falling ball impact experiments. The results indicate that the numerical simulation can accurately reflect the actual response and fracture morphology of substrate glass in falling ball impact experiment. In numerical simulation, the falling ball impact strength of electronic substrate glass, characterized by the residual mass ratio, exhibits a non-linear relationship with the residual tensile stress in the impacted area. The falling ball impact strength experiences a rapid decline when residual tensile stress exceeds a certain threshold. The residual tensile stress in the impact area significantly amplifies the stress generated by the falling ball impact. A mere 1.0 MPa residual tensile stress could cause the stress generated by the impact to elevate by approximately 10 MPa relative to the situation without residual stress, which is a vital reason for the fall in the falling ball impact strength of electronic substrate glass.