To improve the thermal performance of vertical-cavity surface-emitting laser arrays, reduce the temperature difference between individual emitting units within the device, and enhance the device's output power and light emission uniformity, a novel heat dissipation structure is proposed. This structure involves filling the transition heat sink with two materials with significantly different thermal conductivities. First, using finite element analysis software, a multigroove structure is introduced into a traditional silicon carbide transition heat sink and filled with copper-diamond and aluminum nitride materials. Subsequently, through thermal simulation analysis of the materials filled in multiple grooves and etching depths, the temperature variation in each unit in the array device with changing parameters is investigated. Finally, the structural parameters are optimized to design a new heat dissipation structure. Compared to traditional heat dissipation structures, the overall output power of the new structure device is increased by 14.2%. Simulation of the temperature distribution of the new structure encapsulating the array device reveals that the maximum temperature difference between individual emitting units is reduced from an initial 10.94 K to 0.15 K.