We propose a dual laser simultaneous etching and cleaning technique to solve the issues of residual glue (blockage), over-etching, sidewall damage, and tedious subsequent processing of blind holes in copper clad laminates by nanosecond laser etching. First-order blind hole etching experiments were conducted on copper clad laminates using nanosecond and nanosecond-matched picosecond lasers. Furthermore, a blind hole with a 122.24 μm diameter, a (37.02 ± 0.04) μm depth (37.00 μm processing requirement), a 0.16 μm bottom roughness, and a 0.25 μm surface roughness on the side walls was etched without shrinkage on a 49.00 μm-thick copper clad plate using the nanosecond-matched picosecond laser. The results indicate a significant improvement in the processing accuracy and quality of the dual laser etching and cleaning process for the copper clad plates, thereby obtaining high-quality blind holes. In conclusion, the nanosecond-matched picosecond laser shows superior etching depth (accuracy), cleanliness, taper, and roughness compared to the nanosecond laser.