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    Journals >Nano-Micro Letters >Volume 15 >Issue 1 >Page 199 > Article
    • Nano-Micro Letters
    • Vol. 15, Issue 1, 199 (2023)
    Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse
    Chao Wei1, Wansheng Lin1, Liang Wang2, Zhicheng Cao1..., Zijian Huang1, Qingliang Liao3,4, Ziquan Guo1, Yuhan Su1, Yuanjin Zheng5, Xinqin Liao1,* and Zhong Chen1,**|Show fewer author(s)
    Author Affiliations
  • 1Department of Electronic Science, Xiamen University, Xiamen 361005, People’s Republic of China
  • 2Department of Engineering Mechanics, School of Naval Architecture, Ocean and Civil Engineering, Shanghai Jiao Tong University, Shanghai 200240, People’s Republic of China
  • 3Academy for Advanced Interdisciplinary Science and Technology, Beijing Advanced Innovation Center for Materials Genome Engineering, University of Science and Technology Beijing, Beijing 100083, People’s Republic of China
  • 4Beijing Key Laboratory for Advanced Energy Materials and Technologies, School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People’s Republic of China
  • 5School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore 639798, Singapore
    • show less
    DOI: 10.1007/s40820-023-01176-5 Cite this Article
    Chao Wei, Wansheng Lin, Liang Wang, Zhicheng Cao, Zijian Huang, Qingliang Liao, Ziquan Guo, Yuhan Su, Yuanjin Zheng, Xinqin Liao, Zhong Chen. Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse[J]. Nano-Micro Letters, 2023, 15(1): 199 Copy Citation Text show less
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    Chao Wei, Wansheng Lin, Liang Wang, Zhicheng Cao, Zijian Huang, Qingliang Liao, Ziquan Guo, Yuhan Su, Yuanjin Zheng, Xinqin Liao, Zhong Chen. Conformal Human–Machine Integration Using Highly Bending-Insensitive, Unpixelated, and Waterproof Epidermal Electronics Toward Metaverse[J]. Nano-Micro Letters, 2023, 15(1): 199
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