[1] X Y YAN, J CHENG, D BIAN et al. Surface profile measurement of doped silicon using near-infrared low-coherence light. Applied Optics, 58, 7436-7442(2019).
[2] Y S PARK. A novel method for simultaneous measurement of thickness， refractive index， bow， and warp of a large silicon wafer using a spectral-domain interferometer. Metrologia： International Journal of Scientific Metrology, 57(2020).
[3] Y KIM, N SUGITA, M MITSUISHI. Measurement of surface profile and thickness of multilayer wafer using wavelength-tuning fringe analysis. Precision Engineering, 52, 130-137(2018).
[4] Y H ZENG, Y X FU, D M TANG et al. Standard measuring device for thickness of silicon wafer based on laser compensation system(2018).
[5] H AKIKO, B YOUICHI, B JAESEOK et al. Precise measurement of the thickness of silicon wafers by double-sided interferometer and bilateral comparison. Metrologia, 58(2021).
[6] 张志荣， 洪汉玉， 章秀华. 基于光谱共焦的电路板微型元器件三维高精度检测［J］. 计算机与数字工程， 2022， 50（9）： 2102-2108.ZHANGZH R， HONGH Y， ZHANGX H. High-precision 3D inspection of circuit board micro components based on spectral confocal sensor［J］. Computer & Digital Engineering， 2022， 50（9）： 2102-2108.（in Chinese）
[7] A PHOULADY, H CHOI et al. A novel material detection method using femtosecond laser， confocal imaging and image processing enabling endpointing in fast inspection of microelectronics. Microelectronics Reliability, 126, 114287(2021).
[8] J A CASTILLO-BADILLO, A CABRERA-WROOMAN, J A GARCÍA-SÁINZ. Visualizing G protein-coupled receptors in action through confocal microscopy techniques. Arch Med Res, 45, 283-293(2014).
[9] Y C LEE. Low-frequency membrane tension measurement of framed membranes in semiconductor manufacturing. Sensors and Actuators, 355, 114312(2023).
[10] 邱丽荣， 崔晗， 王允， 等. 激光差动共焦拉曼光谱高分辨图谱成像技术进展［J］. 光学学报， 2023， 43（15）： 3788/AOS230753. doi: 10.3788/AOS230753QIUL R， CUIH， WANGY， et al. Research progress on high resolution laser differential confocal Raman spectroscopy［J］. Acta Optica Sinica， 2023， 43（15）： 3788/AOS230753.（in Chinese）. doi: 10.3788/AOS230753
[11] 邵谭彬， 杨克成， 夏珉， 等. 光谱共焦显微成像技术与应用［J］. 激光与光电子学进展， 2023， 60（12）： 3788/LOP222655. doi: 10.3788/LOP222655SHAOT B， YANGK CH， XIAM， et al. Techniques and applications of chromatic confocal microscopy［J］. Laser & Optoelectronics Progress， 2023， 60（12）： 3788/LOP222655.（in Chinese）. doi: 10.3788/LOP222655
[12] 顾敏. 共焦显微术的三维成像原理［M］. 北京： 新时代出版社， 2000.GUM. Principles of Three-dimensional Imaging in Confocal Microscopes［M］. Beijing： New Times Press， 2000.（in Chinese）
[13] 李春艳， 李庚鹏， 刘继红， 等. 光谱共焦法偏心下径向梯度折射率透镜的厚度测量［J］. 光学 精密工程， 2022， 30（17）： 2067-2076. doi: 10.37188/OPE.20223017.2067LIC Y， LIG P， LIUJ H， et al. Thickness measurement of radial gradient index lens under eccentricity by spectral confocal method［J］. Opt. Precision Eng.， 2022， 30（17）： 2067-2076.（in Chinese）. doi: 10.37188/OPE.20223017.2067
